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Cloud Computing PCB Prototype 94V-0 China PCB Service
Chigadzirwa Specification
| Base Material: | FR4 TG140 |
| PCB Ukobvu: | 1.6+/-10% mm |
| Layer Count: | 6L |
| Hukobvu hwemhangura: | 1/1/1/1/1/1 oz |
| Surface treatment: | 1U CHETE” |
| Solder mask: | Girinhi |
| Silkscreen: | Chena |
| Nzvimbo yekushandisa: | Cloud Computing |
Yakakwirira-Kuita 6-Layer PCB ye Cloud Computing - Yakavimbika PCB Prototype China Solution
Kutsvaga Yepamusoro-mhando yakadhindwa edunhu mabhodhi e Cloud Computer Equipment?
Yedu yepamusoro 6-layer board yakanyatsogadzirirwa nharaunda dzinoda. Yakagadzirwa neFR4 zvinhu, ine yakapedzwa bhodhi ukobvu hwe1.6mm, 1oz yemukati / yekunze yakatsetseka ukobvu hwemhangura, uye 1μ" kunyudzwa kwegoridhe pamusoro pekupedzisira, ichipa yakasarudzika chiratidzo chekuvimbika uye kugona solder.
Bhodhi racho rakasimbiswa kune 94V-0 murazvo unodzoreredza mwero, unosangana nezvinodiwa zvekuchengetedza. Makiyi ma paramita anosanganisira 3.3/3.8mil shoma mutsetse wakafara/spacing, 0.2mm hushoma hwegomba saizi, uye 6mil buri-kusvika-mukati-layer clearance, kuve nechokwadi chepamusoro-density nzira uye kuita kwakavimbika.
Semugadziri akavimbika wePCB muChina, tinopa rutsigiro rwakakwana kubva kuprototyping kusvika pakugadzirwa kwevhoriyamu. Munzvimbo ino yekukurumidza kufambira mberi mukombuta uye makore computing tekinoroji, iyo Yakadhindwa Circuit Board (PCB) inoshanda sehwaro hwehwaro hwezvinhu zvese zvemagetsi.
Mumasevha epamusoro-soro uye nzvimbo dzedata, aya ma-multi-layer, high-frequency PCB board anoita se "moyo wakasimba" we cloud computing. Ivo vanofambisa yakakwirira-kumhanya kufambisa data, kuve nechokwadi chechiratidzo chekuvimbika pakati peCPU, GPU, uye ndangariro kutsigira hukuru hwakafanana computations uye kure kure desktop kutenderera. Kutonga kwavo kwepamusoro kwemafuta uye kutendeseka kwesimba kwakakosha pakuvimbisa 24/7 kusakanganiswa kwe server kushanda.
Kune ekupedzisira-mushandisi zvishandiso, angave akareruka ekuwana materminal kana epamusoro-anoita mauto, PCB dhizaini inoisa pamberi compactness uye kugona. Yakakwira-Density Interconnect tekinoroji inogonesa yakawanda compact mama bhodhi marongero ane hukuru hunyanzvi hwekubatanidza, nepo yakagadziridzwa simba manejimendi inopa yakatsetseka, yakaderera-latency cloud desktop chiitiko.