Tsika 2-layer yakaoma PCB ine red solder mask
Kutsanangurwa kweChigadzirwa:
| Base Material: | FR4 TG130 |
| PCB Ukobvu: | 1.6+/-10%mm |
| Layer Count: | 2L |
| Hukobvu hwemhangura: | 35um/35um |
| Surface Treatment: | HASL inotungamira yemahara |
| Solder Mask: | Tsvuku |
| Silkscreen: | Chena |
| Special process: | Hapana |
Application
Kaviri-sided redunhu bhodhi rinonyanya kugadzirisa dhizaini yakaoma dhizaini uye nzvimbo isingakwanisi, pamativi ese ebhodhi akaisirwa zvikamu, kaviri-layer kana akawanda-layer wiring.Double-sided PCBs inowanzoshandiswa mukutengesa michina, mbozhanhare, UPS masisitimu. , amplifiers, masisitimu ekuvhenekesa, uye madhibhodhi emotokari. Maviri-mativi maPCB akanakisa epamusoro tekinoroji application, compact yemagetsi maseketi, uye yakaoma maseketi. Kushandiswa kwayo kwakakura zvakanyanya uye mutengo wakaderera.
FAQs
Iyo 2-layer PCB imhangura yakavharwa mativi ese ane insulating layer iri pakati. Iyo ine zvikamu pamativi ese ebhodhi, ndosaka ichinzi zvakare kaviri-mativi PCB. Iwo anogadzirwa nekubatanidza maviri akaturikidzana emhangura pamwechete, aine dielectric zvinhu pakati.
Iwe unogona kufungidzira kuti musiyano uripo uri pakati pezvikamu zviviri zvePCB uye 4 akaturikidzana PCB zvinoenderana nemazita avo. 2 akaturikidzana PCB ine mativi maviri akatevedzana ane pamusoro nepasi pasi, nepo 4 akaturikidzana PCB ine 4 akaturikidzana. Kana uine kunzwisisa zviri nani mhando mbiri PCB mapuranga, uchaona kuti pane misiyano yakawanda sei kuvakwa uye sei kushanda.
Single-sided PCB traces iripo kune rimwe divi chete, nepo maviri-sided PCBs ane zviteedzere mativi ese ane epamusoro uye epasi akaturikidzana. Izvo zvikamu uye conductive mhangura yakaiswa pamativi ese maviri-mativi PCB, uye izvi zvinotungamira kune mharadzano kana kupindirana kweiyo trace.
Hongu, ingotitumira gerber yako faira.
3WDS.
The2 layer PCB(yakapetwa kaviri PCB) ibhodhi redunhu rakadhindwa rine mhangura yakavharwa mativi ese, kumusoro uye pasi. Pane insulating layer iri pakati, inova inowanzoshandiswa yakadhindwa redunhu bhodhi. Mativi ese ari maviri anogona kuve marongerwo uye soldered, izvo zvinoderedza zvakanyanya kuoma kwekugadzirisa, saka inoshandiswa zvakanyanya.
Kuti ushandise masekete pamativi ese, panofanirwa kuve nekubatana kwedunhu kwakakodzera pakati pemativi maviri. Iwo "mabhiriji" pakati pematunhu akadaro anonzi vias. A via igomba diki paPCB board yakazadzwa kana kuvharwa nesimbi, iyo inogona kubatanidzwa nemasekete pamativi ese. Nemhaka yokuti nzvimbo yebhodhi remativi maviri yakakura zvakapetwa kaviri kupfuura yebhodhi rimwe-sided, bhodhi rine mativi maviri rinogadzirisa kuoma kwebhodhi rimwe chete nekuda kwekugadzirwa kwepakati (inogona kubatanidzwa kune rumwe rutivi. kuburikidza nemakomba), uye yakanyatsokodzera maseketi akaomarara kupfuura bhodhi-rimwe divi.
Tinoda zvigadzirwa zvemagetsi nekushanda kwepamusoro, hukuru hudiki, uye mabasa akawanda, izvo zvinokurudzira kukurudzirwa kwekugadzirwa kwebhodhi redunhu rakadhindwa kuti rive rakareruka, rakatetepa, pfupi, uye duku. Iine nzvimbo shoma, mamwe mabasa anogona kuitika, density yekumisikidza yave yakakura, uye dhayamita yegomba idiki. Iyo shoma yegomba dhayamita yemagetsi ekuboora simba yadzika kubva pa 0.4mm kusvika 0.2mm kana kunyange idiki. Iyo gomba dhayamita yePTH iri kuita diki uye diki. Hunhu hwePTH (Plated Through Hole) iyo iyo layer-to-layer interconnection inoenderana zvakananga nekuvimbika kwedhinda redunhu.
Zvigadzirwa zvikamu
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