Tsika 4-layer Black Soldermask PCB ine BGA
Kutsanangurwa kweChigadzirwa:
| Base Material: | FR4 TG170+PI |
| PCB Ukobvu: | Yakasimba: 1.8+/-10%mm, flex: 0.2+/-0.03mm |
| Layer Count: | 4L |
| Hukobvu hwemhangura: | 35um/25um/25um/35um |
| Surface Treatment: | ENIG 2U” |
| Solder Mask: | Glossy green |
| Silkscreen: | Chena |
| Special process: | Rigid+flex |
Application
Parizvino, tekinoroji yeBGA yakashandiswa zvakanyanya mundima yekombuta (inotakurika komputa, supercomputer, mauto komputa, telecommunication komputa), nhandare yekukurukurirana (mapeji, nhare dzinotakurika, modem), munda wemotokari (akasiyana vatongi einjini dzemotokari, zvigadzirwa zvevaraidzo zvemotokari) .Inoshandiswa mumhando dzakasiyana-siyana dzezvisina kuvharwa, izvo zvinonyanya kuzivikanwa ndezvekuti arrays, network uye connectors.Zvishandiso zvaro chaizvo zvinosanganisira walkie-talkie, mutambi, dhijitari kamera uye PDA, nezvimwe.
FAQs
BGAs (Ball Grid Arrays) zvinhu zveSMD zvine zvinongedzo pazasi pechikamu.Pini imwe neimwe inopiwa nebhora rekutengesa.Zvese zvinongedzo zvakagoverwa muyunifomu yepamusoro grid kana matrix pane chikamu.
BGA mapuranga ane zvakawanda interconnections kupfuura zvakajairika PCBs, kubvumira kune yakakwirira-density, madiki saizi PCBs.Sezvo mapini ari pasi pebhodhi, zvinotungamira zvakare zvakapfupika, zvichipa zvirinani conductivity uye nekukurumidza kuita kwechigadzirwa.
Zvikamu zveBGA zvine chivakwa chavanozozvigadzirisa sezvo solder ichinyorovesa uye ichiomesa iyo inobatsira nekuiswa kusina kukwana..Chikamu chacho chinobva chapisa kuti chibatanidze zvinotungamirira kuPCB.Gomo rinogona kushandiswa kuchengetedza nzvimbo yechikamu kana soldering ichiitwa nemaoko.
BGA mapakeji anopayakakwira pini density, yakaderera kupisa kwekudzivirira, uye yakaderera inductancekupfuura mamwe marudzi emapakeji.Izvi zvinoreva mamwe mapini ekubatanidza uye kuwedzera kwekuita nekumhanya kwakanyanya sekuenzaniswa nembiri mumutsara kana mapakeji akafuratira.BGA haisi isina zvipingamupinyi zvayo, zvakadaro.
Iwo BGA ICs arizvakaoma kuongorora nekuda kwepini dzakavigwa pasi pepakeji kana muviri weIC.Saka kuongorora kwekuona hakugoneki uye de-soldering yakaoma.Iyo BGA IC solder yakabatana nePCB pad inowanzoitika kune flexural kusagadzikana uye kuneta kunokonzerwa nekudziya patani mu reflow soldering process.
Ramangwana reBGA Package yePCB
Nekuda kwezvikonzero zvekudhura uye kusimba, iwo BGA mapakeji anozonyanya kufarirwa mumisika yemagetsi neyemagetsi zvigadzirwa mune ramangwana.Uyezve, kune akawanda akasiyana BGA pasuru mhando dzakagadzirwa kuti dzisangane nezvinodiwa zvakasiyana muPCB industy, uye kune zvakawanda zvakanakira nekushandisa tekinoroji iyi, saka tinogona kutarisira ramangwana rakajeka nekushandisa iyo BGA package, kana une chinodiwa, ndapota inzwa wakasununguka kutibata nesu.
