Industrial PCB zvemagetsi PCB yakakwirira TG170 12 akaturikidzana ENIG
Kutsanangurwa kweChigadzirwa:
| Base Material: | FR4 TG170 |
| PCB Ukobvu: | 1.6+/-10%mm |
| Layer Count: | 12L |
| Hukobvu hwemhangura: | 1 oz yezvikamu zvose |
| Surface treatment: | ENIG 2U" |
| Solder mask: | Glossy green |
| Silkscreen: | Chena |
| Special process : | Standard |
Application
High Layer PCB (High Layer PCB) iPCB (Yakadhindwa Circuit Board, yakadhindwa redunhu bhodhi) ine mitsara inodarika masere.Nekuda kwemabhenefiti ayo eakawanda-layer redunhu redhisheni, yakakwira dunhu density inogona kuwanikwa mune diki tsoka, ichigonesa yakanyanya kuomarara dhizaini dhizaini, saka yakanyatsokodzera yakakwirira-kumhanya yedhijitari masaini kugadzirisa, microwave redhiyo frequency, modem, yakakwirira-kuguma. server, kuchengetedza data uye mamwe minda.Mabhodhi ematunhu epamusoro-soro anowanzo kugadzirwa nepamusoro-TG FR4 mabhodhi kana zvimwe zvepamusoro-soro substrate zvinhu, izvo zvinogona kuchengetedza kugadzikana kwedunhu mukupisa kwepamusoro, kunyorova, uye nzvimbo dzepamusoro-frequency.
Nezve TG kukosha kweFR4 zvinhu
FR-4 substrate is epoxy resin system, saka kwenguva yakareba, kukosha kweTg ndiyo indekisi inonyanya kushandiswa kurongedza FR-4 substrate giredhi, zvakare imwe yeanonyanya kukosha ekuita zviratidzo muIPC-4101 yakatarwa, iyo Tg. kukosha kweresin system, inoreva zvinhu kubva kune yakaomesesa kana "girazi" mamiriro kune kuremara nyore kana kupfavisa tembiricha yemamiriro ekuchinja.Iyi shanduko ye thermodynamic inogara ichidzoserwa chero bedzi resin isingaori.Izvi zvinoreva kuti kana chinhu chikapisa kubva mukamuri tembiricha kusvika kune tembiricha iri pamusoro peiyo Tg kukosha, uye yobva yatonhodzwa pasi peiyo Tg kukosha, inogona kudzokera kune yayo yapfuura yakaomarara mamiriro ane zvimwe chete zvinhu.
Nekudaro, kana iyo chinhu ichidziya kune tembiricha yakakwira zvakanyanya kupfuura kukosha kwayo kweTg, isingadzokerike chikamu shanduko shanduko inogona kukonzerwa.Mhedzisiro yeiyi tembiricha ine zvakawanda zvine chekuita nerudzi rwezvinhu, uye zvakare nekuparara kwekupisa kweresin.Kazhinji kutaura, iyo yakakwirira iyo Tg ye substrate, iyo yakakwirira kuvimbika kwezvinhu.Kana iyo inotungamira-isina welding process yakagamuchirwa, iyo yekupisa yekupisa tembiricha (Td) ye substrate inofanirawo kutariswa.Zvimwe zvakakosha zvinoratidzira zvinosanganisira thermal expansion coefficient (CTE), kunyura kwemvura, adhesion zvimiro zvechinhu, uye inowanzoshandiswa layering nguva bvunzo seye T260 uye T288 bvunzo.
Musiyano uri pachena pakati peFR-4 zvinhu ndeye Tg kukosha.Zvinoenderana neTg tembiricha, FR-4 PCB inowanzo kukamurwa kuita yakaderera Tg, yepakati Tg uye yakakwirira Tg mahwendefa.Muindasitiri, FR-4 ine Tg yakatenderedza 135 ℃ inowanzo kurongerwa seyakaderera Tg PCB;FR-4 panenge pa150 ℃ yakashandurwa kuita yepakati Tg PCB.FR-4 ine Tg yakatenderedza 170 ℃ yakarongedzerwa seyakakwira Tg PCB.Kana paine nguva zhinji dzekutsikirira, kana PCB layers (kupfuura 14 layers), kana yakakwirira welding tembiricha (≥230 ℃), kana yakakwirira kushanda tembiricha (kupfuura 100 ℃), kana yakakwirira welding thermal stress (senge wave soldering), yakakwirira Tg PCB inofanira kusarudzwa.
FAQs
Iri mubatanidzwa wakasimba zvakare rinoita kuti HASL ive yakanaka kupera kwepamusoro-kuvimbika maapplication.Nekudaro, HASL inosiya nzvimbo isina kuenzana kunyangwe maitiro ekuenzanisa.ENIG, kune rumwe rutivi, inopa nzvimbo yakati sandara ichiita kuti ENIG ive yakanakira kurira kwakanaka uye yakakwirira pini kuverenga zvikamu kunyanya bhora-grid array (BGA) zvishandiso.
Izvo zvakajairika zvinhu zvine yakakwira TG yatakashandisa ndeye S1000-2 uye KB6167F, uye iyo SPEC.sezvinotevera,
