Multi redunhu mapuranga pakati TG150 8 akaturikidzana
Kutsanangurwa kweChigadzirwa:
| Base Material: | FR4 TG150 |
| PCB Ukobvu: | 1.6+/-10%mm |
| Layer Count: | 8L |
| Hukobvu hwemhangura: | 1 oz yezvikamu zvose |
| Surface treatment: | HASL-LF |
| Solder mask: | Glossy green |
| Silkscreen: | Chena |
| Special process : | Standard |
Application
Ngatitangei ruzivo rwepcb mhangura ukobvu.
Copper foil se pcb conductive body, kunamatira nyore kune insulation layer, corrosion form circuit pattern.Ukobvu hwemhangura foil inoratidzwa mu oz(oz), 1oz = 1.4mil, uye avhareji ukobvu hwemhangura foil inoratidzwa muhuremu payuniti. nharaunda neformula: 1oz=28.35g/ FT2(FT2 inya mativi mana, 1 sikweya tsoka =0.09290304㎡).
International pcb mhangura foil inowanzoshandiswa ukobvu: 17.5um, 35um, 50um, 70um.Kazhinji, vatengi havaite zvakakosha kutaura pakuita pcb.Hukobvu hwemhangura hwemativi ega uye maviri anowanzo 35um, kureva, 1 amp copper.Ehe, mamwe emamwe mabhodhi akanyanya achashandisa 3OZ, 4OZ, 5OZ ... 8OZ, nezvimwewo, zvinoenderana nezvinodiwa zvechigadzirwa kuti usarudze hukobvu hwakakodzera hwemhangura.
Ukobvu hwemhangura hwekamwe uye hwakapetwa kaviri PCB bhodhi hunosvika 35um, uye humwe hukobvu hwemhangura i50um uye 70um.Ukobvu hwemhangura hwepamusoro hweplate ye multilayer kazhinji 35um, uye mukati memhangura ukobvu i17.5um.Kushandiswa kwePcb bhodhi mhangura ukobvu kunonyanya kunoenderana nekushandiswa kwePCB uye chiratidzo chemagetsi, saizi yazvino, 70% yebhodhi redunhu rinoshandisa 3535um mhangura foil ukobvu.Ehe, kune yazvino yakakurisa redunhu bhodhi, ukobvu hwemhangura huchashandiswawo 70um, 105um, 140um (vashoma kwazvo)
Pcb bhodhi kushandiswa kwakasiyana, kushandiswa kwemhangura ukobvu kwakasiyanawo.Kufanana nevatengi vakajairwa uye zvigadzirwa zvekutaurirana, shandisa 0.5oz, 1oz, 2oz;Kune yakawanda yeazvino hombe, senge yakakwira voltage zvigadzirwa, magetsi emagetsi bhodhi uye zvimwe zvigadzirwa, kazhinji shandisa 3oz kana pamusoro zvikobvu zvemhangura zvigadzirwa.
Iyo lamination process yedunhu mabhodhi inowanzoita seinotevera:
1. Kugadzirira: Gadzirira muchina welaminating uye zvinhu zvinodiwa (kusanganisira mapuranga edunhu uye mapepa emhangura kuti ave laminated, kudzvanya mahwendefa, nezvimwewo).
2. Kuchenesa kurapwa: Chenesa uye deoxidize pamusoro pebhodhi redunhu uye foil yemhangura kuti isimbiswe kuti ivimbise zvakanaka soldering uye kushanda kwekubatana.
3. Lamination: Laminate foil yemhangura uye bhodhi redunhu zvinoenderana nezvinodiwa, kazhinji imwe dhizaini yedunhu redunhu uye imwe dhizaini yemhangura foil inorongedzerwa neimwe nzira, uye pakupedzisira akawanda-layer redunhu bhodhi rinowanikwa.
4. Kuisa uye kudzvanya: isa laminated redunhu bhodhi pamushini wekutsikirira, uye dzvanya multi-layer redunhu bhodhi nekumisa ndiro yekutsikirira.
5. Kutsikirira nzira: Pasi penguva yakatarwa uye kumanikidzwa, bhodhi redunhu uye foil yemhangura zvinomanikidzwa pamwe chete nemuchina wekutsikirira kuitira kuti zvibatanidzwe zvakasimba pamwe chete.
6. Kutonhodza kurapwa: Isai yakatsikirirwa redunhu bhodhi pachikuva chekutonhodza chekurapa kwekutonhodza, kuitira kuti isvike pakudzikama tembiricha uye mamiriro ekumanikidza.
7.Subsequent processing: Wedzera zvidziviriro pamusoro pebhodhi redunhu, ita zvinotevera kugadzirisa zvakadai sekuchera, kuiswa kwepini, nezvimwewo, kuti upedze iyo yose yekugadzirwa kwebhodhi redunhu.
FAQs
Ukobvu hwemhangura yemhangura inoshandiswa kazhinji inotsamira pane yazvino inoda kupfuura nePCB.Ukobvu hwemhangura hwakajairika hunosvika 1.4 kusvika 2.8 mils (1 kusvika 2 oz)
Iyo shoma PCB yemhangura ukobvu pane copper-clad laminate ichave 0.3 oz-0.5oz
Minimum ukobvu PCB izwi rinoshandiswa kutsanangura kuti ukobvu hweakadhindwa wedunhu bhodhi hwakatetepa kupfuura yakajairika PCB.Ukobvu hwakajairika hwebhodhi redunhu parizvino 1.5mm.Ukobvu hushoma ndeye 0.2 mm kune mazhinji emabhodhi edunhu.
Mamwe emhando akakosha anosanganisira: chinodzoreredza moto, dielectric kugara, kurasikirwa chinhu, kusimba kwesimba, kugera simba, tembiricha yegirazi, uye kuwanda kunoshanduka netembiricha (iyo Z-axis yekuwedzera coefficient).
Icho chinhu chekudzivirira chinosunga macores ari padyo, kana musimboti uye mutsetse, muPCB stackup.Izvo zvakakosha zvinoshanda zve prepregs ndezvekusunga musimboti kune imwe musimboti, kusungira musimboti kune layer, kupa insulation, uye kudzivirira multilayer board kubva kupfupi-circuiting.
